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This is a In Vitro Study study.

August 18, 2025MetalsOpen Access

Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications

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Experimental analysis shows improved thermal conductivity and microstructure in solder alloys, indicating their usefulness in electronics.

Bi-Sn, Bi-Sn-Ag, and Bi-Sn-Sb solder alloys demonstrate enhanced properties for electronic applications.
Thermal conductivity measurements indicate Bi60Sn40 increases from 16.93 to 26.93 W/m·K over 25–140 °C.
Microstructural analysis shows distinct phase segregation influenced by alloying elements like Sb and Ag.
Improved mechanical strength and conductivity in Sb- and Ag-modified Bi-Sn alloys may enable better electronic soldering solutions.

Ilie et al. (2025) studied this question.

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Experimental analysis shows improved thermal conductivity and microstructure in solder alloys, indicating their usefulness in electronics.