Striving for Perfection - MEMS Sensors Based on Wafer Chip Fabrication Process Technology

To promote independent technological advancement in chips and break through the technical blockade faced by China's sensor industry, this work has developed a novel process. This process utilizes the solid porous 3D microstructure of Broussonetia papyrifera to achieve microscale thermal isolation, while proposing the use of thin-film layered structures of Broussonetia papyrifera to optimize and improve existing thermal MEMS devices. Breakthroughs in process preparation technology enable the production of precision MEMS sensors. Currently, this product achieves a micron-level process grade and supports wafer fabrication in both 8-inch and 10-inch sizes. Under the same 10-inch standard scale, the unit batch yield reaches 98.76%, with up to 576 sensor chips per single wafer, representing industry-leading performance. Due to these characteristics, the product has been widely applied in smart vehicles, intelligent healthcare, electronic resonance sensors, and other fields.