Electroless Pd Nanolayers for Low-Temperature Hybrid Cu Bonding Application: Comparative Analysis with Electroplated Pd Nanolayers

As 3D stacking technologies advance, low-temperature hybrid Cu bonding has become essential for fine-pitch integration. This study focuses on evaluating Pd nanolayers deposited by electroless plating (ELP) on Cu surfaces and compares them to electroplated (EP) Pd to assess their suitability for hybrid bonding. Pd nanolayers (5~7 nm) were deposited on Cu films, and their surface morphology, crystallinity, and chemical composition were characterized using AFM, TEM, GIXRD, and XPS. EP-Pd layers exhibited lower roughness and larger grain size, acting as effective Cu diffusion barriers. In contrast, ELP-Pd layers showed small grains, higher surface roughness, and partial Cu diffusion and oxidation. At 200 °C, both Pd layers enabled bonding, but ELP-Pd samples achieved more uniform and continuous interfaces with thinner copper oxide layers. Shear testing revealed that ELP-Pd samples exhibited higher average bonding strength (20.58 MPa) and lower variability compared to EP-Pd (16.47 MPa). The improved bonding performance of ELP-Pd is attributed to its grain-boundary-driven diffusion and uniform interface formation. These findings highlight the potential of electroless Pd as a passivation layer for low-temperature hybrid Cu bonding and underscore the importance of optimizing pre-bonding surface treatments for improved bonding quality.