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The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub is proposed, with 3D full-wave numerical simulation used for modeling and simulation. Results show that this scheme optimizes the return loss and insertion loss while making the signal eye diagram more ideal, which can improve the transmission effect of high-speed signals.
Xu et al. (Mon,) studied this question.