In this study, we developed a novel negative tone photosensitive polyimide with ultra-low temperature (<200°C) curability and high planarity to reduce undulation of the substrate including a 10 μm thickness line pattern and Cu wire. In addition, this photosensitive polyimide achieved 5 μm via holes at 5 μm thickness on the Cu substrate, low coefficient of thermal expansion (50 ppm/K) and high Tg (230°C) when cured at 170°C.
No takes yet. Share an insight, caveat, or question.
Yoshizawa et al. (2024) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: