In this study, System-in-Package (SiP) module with higher component density and smaller form size was demonstrated through selective structure. The selective EMI shielding at partial molding area for specific substrate circuit exposure through roller-type auto taping / detaping of PI tape was performed. This PI tape was applied on to designed area and form a co-shape masking through package singulation. The sacrification PI tape was successively removed after sputter deposition and no sputter issue such as burnmark, overflow and glue residue was found. Finally, the SMT quality of connector mount was also confirmed and all meet criteria of mass production.
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Chen et al. (2024) studied this question.
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