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Extended reality (XR) applications are machine learning (ML)-intensive, featuring deep neural networks (DNNs) with millions of weights, tightly latency-bound (10–20 ms end-to-end), and power-constrained (low tens of mW average power). While ML performance and efficiency can be achieved by introducing neural engines within low-power systems-on-chip (SoCs), system-level power for nontrivial DNNs depends strongly on the energy of non-volatile memory (NVM) access for network weights. This work introduces Siracusa , a near-sensor heterogeneous SoC for next-generation XR devices manufactured in 16 nm CMOS. Siracusa couples an octa-core cluster of RISC-V digital signal processing (DSP) cores with a novel tightly coupled "At-Memory" integration between a state-of-the-art digital neural engine called and an on-chip NVM based on magnetoresistive random access memory (MRAM), achieving 1.7 <tex-math notation="LaTeX">×</tex-math> higher throughput and 3 <tex-math notation="LaTeX">×</tex-math> better energy efficiency than XR SoCs using NVM as background memory. The fabricated SoC prototype achieves an area efficiency of 65.2 GOp/s/mm <tex-math notation="LaTeX">²</tex-math> and a peak energy efficiency of 8.84 TOp/J for DNN inference while supporting complex, heterogeneous application workloads, which combine ML with conventional signal processing and control.
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Prasad et al. (2024) studied this question.
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