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May 23, 2024Journal of Adhesion Science and Technology

Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging

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Authors

MZMuhammad Nubli ZulkifliIAIzhan AbdullahNANurul Hanis Azhan

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Overview

Experimental analysis demonstrates micromechanical degradation in mixed solder joints during isothermal aging, highlighting the role of intermetallic compound growth.

Key Points

  • After 1000 h of isothermal aging, intermetallic compound growth and tin-rich grain refinement govern hardness and stress exponent evolution in mixed joints.
  • Nanoindentation testing and scanning electron microscopy with ImageJ analysis evaluated micromechanical properties and phase distribution across alloys.
  • Highlights how grain boundary sliding creep in SnPb/SnCu joints is driven by clustered lead-rich particles along tin-rich grain boundaries under stress.

Cite This Study

Zulkifli et al. (2024) studied this question.

synapsesocial.com/papers/68e68be8b6db643587613799https://doi.org/10.1080/01694243.2024.2356962
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