The research and discussion in this paper, there are package design with the structure of FOCoS (Fan Out Chip on Substrate) for an actual high-performance computing IC device with ASIC (Application Specific Integrated Circuit) chips and HBM (High Bandwidth Memory) chips. In the process of this study, the die-to-die (D2D) interconnection between ASIC chip to ASIC chip is used UCIe (Universal Chiplet Interconnect Express) interface for high speed signal transmission and HBM3/HBM3e is applied on data transfer between ASIC chip to high bandwidth memory. Through electrical analysis, the suitable RDL (Re-Distribution Layer) structure and routing topology are applied on various interface.
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Wang et al. (2024) studied this question.