Multi-beam mask writer MBM-3000 for next generation EUV mask production

The multi-beam mask writer MBM-3000 is launched in 2023 for next generation EUV mask production. It is equipped with 12-nm beamlets and a powerful cathode that brings out a beam current density of 3.6A/cm², in order to achieve higher resolution and faster writing speed than our current writer MBM-2000PLUS. New optics with a next-generation blanking aperture array (BAA) is installed in order to double the beam count. The optics is designed to reduce the Coulomb interaction effects. It is equipped with aberration correctors to reduce image field distortion and other types of aberrations to obtain the best beam performance. Data path is enhanced by the more computation resource and a new data format MBF2.1 which supports curve representation to process curvilinear pattern data efficiently. Writing tests confirmed that the MBM-3000, which uses a 1.5X larger beam current than the MBM-2000, simultaneously enhances both resolution and throughput.