Microelectronic devices often undergo complex thermal environments and mechanical vibrations during operational life. Implementing computer-aided simulation techniques to predict and monitor the structure's health is the most efficient and state-of-the-art method. In this work, we aim to provide a highly accurate compact model of a nonlinear finite element model in the field of microelectronics, which is generated via a trajectory piecewise linear-based nonlinear model order reduction approach. Such a reduced-order model provides a means to capture and represent the intricate deformation behavior of microelectronic structures during plastic deformation.
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Yuan et al. (2024) studied this question.
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