Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior

The complexity of automotive and industrial electronic control units does not allow the use of regular finite element analyses for the complete design optimization with respect to thermomechanical reliability. Therefore, a novel approach is proposed that massively reduces the computational effort without compromising the result accuracy. It is based on a modular system of reduced-order models. In this paper, projection-based methods for capturing the complex material behaviour of solder balls are introduced as key enabler for this approach. It is shown that the discrete empirical interpolation method can reduce the number of degrees of freedom massively to speed-up the simulations with a high accuracy.