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April 7, 2024

Application oriented On-The-Edge Capable Prognostic and Health Monitoring Framework for Solder Joints in Electronics

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Authors

DBDarshankumar BhatSMStefan MuenchMRM. Roellig

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Cite This Study

Bhat et al. (2024) studied this question.

synapsesocial.com/papers/68e701f4b6db64358767bf9fhttps://doi.org/10.1109/eurosime60745.2024.10491479
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Also Consider

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  3. 3Identification of key influencing factors and failure prediction for corrosion in sensitive interconnection structures of electronic devices2026
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  5. 5Prognostics for Semiconductor Sustainability: Tool Failure Behavior Prediction in Fabrication Processes2024 · 3 citations