Scalable Modular Test Chip Structures for Electronic Packaging Evaluations

A Thermal Mechanical Test Chip (TMTC) has been designed to reduce the cycle time and cost of package reliability qualifications. The TMTC moves package reliability assessment closer to the package and assembly development cycle by breaking the tie between silicon qualification and package qualification. This approach demonstrates that relevant thermal-mechanical reliability failure mechanisms can be detected and characterized at significant cost and time savings compared to prior methods.