Answers are grounded in this paper and cite their sources.
This research reveals die attach voids increase MMIC surface temperature by 10%, indicating risks of failure.
This paper describes the use of scanning infrared microscope and finite element modeling to investigate the effect of die attach voids on MMIC surface temperature. Scanning acoustic microscopy is used to measure the volume of the die attach voids. Voids beneath the location of the power transistors were found to significantly increase the thermal resistance resulting in a surface temperature increase of 10 percent. Localized regions of attach voids may also lead to burnout type of catastrophic failures.
No takes yet. Share an insight, caveat, or question.
Strifas et al. (1995) studied this question.
Synapse has enriched 8 closely related papers on similar clinical questions. Consider them for comparative context: