A temperature monitoring system for rotary kilns, based on LoRa technology, has been designed to address challenges such as difficult on-site wiring, high costs, and maintenance and management complexities. The system consists of six distributed terminal collection nodes located on both sides of the various kiln sections, LoRa communication modules, and an upper-level computer system. The collection nodes are composed of STM32L series microcontrollers and infrared sensors, which collect temperature data and transmit it wirelessly using LoRa technology. The temperature data collected by the nodes is transmitted over a LoRaWAN network to a LoRaWAN gateway and further uploaded to the upper-level computer system via RS485 serial communication. Monitoring personnel can observe real-time temperature data on both sides of the rotary kiln at various sections through a PC interface. This system offers advantages such as low power consumption, a simple structure, and ease of maintenance, making it highly applicable in the field of rotary kiln temperature monitoring with broad engineering prospects.
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Hu et al. (2024) studied this question.
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