Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

This paper focuses on the development of a technological challenges of manufacturing the planar ceramic vacuum sensor based on the principles of hot-cathode ionization in the Bayard-Alpert configuration. The goal is to simplify the technological process by utilizing planar platinum structures with gold electrical paths instead of 3-dimensional structures. Various methods were tested, including the use of carbon-based SVM (Sacrifice Volume Materials) materials, but without success. Wet-etching using potassium hydroxide on Al 2 O 3 substrates showed promise results. The findings highlight the challenges and progress made in developing the thermo-emittercomponent of the vacuum sensor.