Heterogeneous Integration in Florida Enabling High Bandwidth Subsystems

In an age of evolving communication standards like 6G and inevitable disruptive technologies spawned by AI, it is necessary to have the flexibility to apply the best semiconductor technologies to meet application requirements. No single technology will deliver the bandwidth, power, and energy efficiency requirements of emerging applications. Combining multiple chiplets like advanced CMOS and III-V requires heterogeneous integration. The Florida semiconductor ecosystem is uniquely positioned to this essential flexibility to solution providers. For example, silicon interposers can be manufactured at NeoCity that combine Damascene BEOL Cu, embedded passives, high aspect thru Silicon vias (TSV), and low-loss interconnect layers. Chiplets integrated on this platform can deliver high bandwidth with minimal power consumption. This presentation will summarize the ongoing work sponsored by the NSF Florida Semiconductor Engine to build the co-design infrastructure required to enable moving designs from R&D concepts to prototypes and demonstration subsystems. These applications are a significant focus area of imec globally with special emphasis on opportunities to grow the market in the US. Anyone tackling challenges created by higher bandwidth requirements should consider attending.