Furthering Moore’s Law Integration Benefits in the Chiplet Era

This is the authors' abstract. We don't add key points for this paper.

Aggressive technology scaling, which has fueled the remarkable growth of the semiconductor industry for past decades, is faced with several fundamental barriers. Under this setting, chiplet technology, which promotes a modular, multidie integration approach to build complex chips in 2.5-D/3-D packages, has shown great promise to further the Moore’s law. This tutorial article focuses on the motivation, challenges, and industrial practices on this innovative chip design solution.