Computational and experimental study demonstrates accurate via capacitance calculation in arbitrarily multilayered PCBs, highlighting improved high-speed signal integrity analysis.
This paper provides a significant improvement to the coaxial-line equation that is used for analytical estimation of via capacitance in multilayered printed circuit boards (PCBs) Previously, a pure coaxial-line equation is used for estimating via capacitance with a maximized and minimized number of pads in high-density multilayered PCBs. Now, in the via capacitance equation, both the capacitances associated to via body and via pads in multilayered PCBs with arbitrary stackups are included. Laboratory measurements by a vector network analyzer and digital inductance-capacitance-resistance ( LCR ) meter, as well as quasi-static and full-wave computational simulations, confirm solid accuracy of the derived equation used for estimating the capacitance of arbitrary signal via geometry common in practice.
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Miroslav M. Pajovic (2008) studied this question.
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