Smoothed particle Galerkin (SPG) modeling of microcrack formation in diamond grinding silicon carbide fiber-reinforced silicon carbide (SiCf/SiC)

This study investigates the smoothed particle Galerkin (SPG) method for modeling microcrack formation in diamond grinding of silicon carbide fiber-reinforced silicon carbide (SiC f /SiC) composites. The SPG method defines material separation by deleting inter-particle bonds rather than using element deletion or particle erosion as in finite element method or smooth particle hydrodynamics modeling. This bond-based failure model preserves the workpiece mass, enabling accurate and stable simulation of microcrack formation. Parallel computing, combined with an optimal domain decomposition strategy, is used to mitigate the extensive computational cost. SPG predicted microcracks align well with observations from scanning electron microscopy and transmission electron microscopy.