Surface Morphology Study of Silicon Carbide Grinding Based on Finite Element Simulation

Silicon carbide is characterized by high hardness and brittleness, making it susceptible to surface damage and residual stress during grinding. Existing studies have mainly focused on individual process parameters or vibration conditions, while systematic comparisons of the effects of grinding parameters, vibration parameters, and abrasive-grain geometry remain limited. In this study, a finite element model of silicon carbide grinding was established using Abaqus to investigate the effects of grinding speed, grinding depth, vibration parameters, and abrasive-grain shape on surface morphology, residual stress, and grinding force. The results show that grinding speed and grinding depth significantly affect surface damage and residual-stress distribution. Vibration-assisted grinding alters the abrasive–workpiece contact state, thereby affecting stress relaxation and crack propagation, while abrasive-grain geometry significantly influences groove morphology, stress concentration, and grinding-force stability. Among the abrasive-grain geometries investigated, conical abrasive grains exhibited lower and more stable grinding forces and produced a more regular machined surface. This study elucidates the effects of different process parameters and abrasive-grain geometries on grinding-induced damage in silicon carbide.