What question did this study set out to answer?

To introduce and evaluate System on Integrated Chips (SoIC), a 3D heterogeneous integration platform designed to stack active and passive chiplets with high-density interconnects while addressing thermal, power delivery, and yield challenges.

May 1, 2019

System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

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To introduce and evaluate System on Integrated Chips (SoIC), a 3D heterogeneous integration platform designed to stack active and passive chiplets with high-density interconnects while addressing thermal, power delivery, and yield challenges.
Fabricated 3D logic-on-logic and memory-on-logic chiplet assemblies using front-end manufacturing processes with sub-10 μm bond pitch rules.
Integrated known good dies (KGDs) across diverse chip sizes, process nodes, and functionalities into a single compact system chip.
Embedded an SoIC chip into an integrated fan-out package-on-package (InFO_PoP) configuration to assess design rules, process maturity, and reliability.
Successfully integrated an SoIC chip into InFO_PoP architecture without expanding the overall package form-factor.
Achieved sub-10 μm bonding pitch scalability, enabling high-density die-to-die interconnects with ultra-short wiring paths.
Demonstrated qualitative improvements in power integrity, signal integrity, communication latency, and energy consumption per bit relative to existing advanced packaging solutions.

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Implication

Experimental study demonstrates 3D chiplet stacking in integrated fan-out packaging, indicating enhanced bandwidth and power efficiency for high-performance computing.

Cite This Study

Chen et al. (2019) studied this question.

synapsesocial.com/papers/6a01d89b1adb974501cafbce https://doi.org/10.1109/ectc.2019.00095

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Implication

Experimental study demonstrates 3D chiplet stacking in integrated fan-out packaging, indicating enhanced bandwidth and power efficiency for high-performance computing.

System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

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Implication

Cite This Study

System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

Key Points

Discussion

Implication

Cite This Study

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