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December 1, 1979IEEE Transactions on Electron Devices92 citations

Integrated signal conditioning for silicon pressure sensors

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JBJohn M. BorkyUniversity of Central FloridaKWK.D. WiseUniversity of Michigan

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Abstract

A silicon-diaphragm pressure sensor containing on-chip circuitry for signal conditioning has been designed for applications in biomedicine. The device requires no off-chip components and only two external leads, making it suitable for use with multisensor catheters having diameters less than 1.5 mm. The output is a temperature-compensated high-frequency FM analog representation of the applied pressure signal. The device exhibits 1-percent resolution and accuracy over the physiological pressure and temperature ranges. Circuit techniques applicable to a variety of active sensors are descried.

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Borky et al. (1979) studied this question.

synapsesocial.com/papers/6a1d29b828423f2ce504d70dhttps://doi.org/10.1109/t-ed.1979.19794
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