The International Roadmap presents electrical fault isolation strategies for die-level innovations, suggesting solutions for evolving challenges.
The EDFAS International Roadmap for Failure Analysis (IRFA) Die-Level Roadmap Council (DLRC) presents its strategic outlook for electrical fault isolation over the next five years, driven by the rapid proliferation of gate-all-around transistors, backside power delivery, heterogeneous integration, and AI-driven design. Across six identified innovation domains — tool development for technology scaling and heterogeneous packaging, workflow evolution, test and diagnostics integration into early design, AI and software tools, and emerging areas — the article maps both the growing limitations of current techniques and the solutions being pursued.
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Dickson et al. (2026) studied this question.
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