Experimental study for dual-channel-MCM reliability with complex condition

Purpose The purpose of this paper is to experimental study for dual-channel-MCM reliability with complex conditions. Design/methodology/approach To investigate the temperature characteristics of multichip module (MCM), a highly integrated dual-channel MCM is tested, combining with the operating environment here. Findings The test results show that in receive-mode (RX) with high gain, the small-signal gain (S21) and the return loss (S11) all reduce by 4.14 and 2.01 dB while the temperature from −40 to 105 °C. Moreover, the output power (Pout) and Gain degrade by 1.64 and 5.68 dB with an input power (Pin) of −6 dBm and frequency (f) of 3.5 GHz, respectively. Likewise, in Rx with low gain and transmit-mode (TX), S11, S21, Pout and gain all exhibit progressive degradation as temperature increases. Leveraging the temperature testing, a temperature-compensation circuit is introduced at the MCM output to counteract thermal drift and guarantee stable operation across the full temperature range. Originality/value These findings provide critical design guidelines to ensure robust circuit operation across thermally dynamic environments.