Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal

Thermal management for high heat flux removal from microelectronic chips is gaining critical importance in many earth-based and space-based systems. Heat fluxes greater than 1 MW/m2 (100 W/cm2) have already been realized in high-end server applications, while cooling needs in next generation chips and advanced systems such as high-power electronics and electrical systems, pulsed power weapons systems, solid-state sensors, and phased-array radars are expected to reach 5–10 MW/m2 (500–1000 W/cm2). After evaluating the contributions from different thermal resistances in the chip-to-ambient thermal path, this paper presents a critical review and research recommendations for three prominent contending technologies: jet impingement, spray cooling, and microchannel heat sinks.