Thermal management for high heat flux removal from microelectronic chips is gaining critical importance in many earth-based and space-based systems. Heat fluxes greater than 1 MW/m2 (100 W/cm2) have already been realized in high-end server applications, while cooling needs in next generation chips and advanced systems such as high-power electronics and electrical systems, pulsed power weapons systems, solid-state sensors, and phased-array radars are expected to reach 5–10 MW/m2 (500–1000 W/cm2). After evaluating the contributions from different thermal resistances in the chip-to-ambient thermal path, this paper presents a critical review and research recommendations for three prominent contending technologies: jet impingement, spray cooling, and microchannel heat sinks.
Kandlikar et al. (Fri,) studied this question.