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Examines heat transfer improvements in trapezoidal fin heat sinks using aerodynamic winglets and nanofluids, suggesting effective thermal management strategies.
In contemporary electronic devices, where overheating can jeopardize performance, reliability, and longevity, effective thermal management remains a major concern. By combining passive geometric optimization utilizing aerodynamic winglets with active enhancement using radiative SWCNT–water nanofluids under magnetic field effects, this study explores a unique hybrid thermal enhancement technique for natural convection heat sinks. To enhance buoyancy‐driven heat transfer, the study is unusual in integrating trapezoidal fins with several aerodynamic winglet designs, including swept rectangular wings, tapered swept wings (TSWs), clipped delta wings (CDWs), and clipped tapered swept wings (CTSWs). The associated effects of thermal radiation, magnetic field, nanoparticle concentration, and winglet geometry were examined throughout a broad range of Rayleigh numbers ( Ra ) using a two‐dimensional numerical model created in COMSOL Multiphysics using the finite element approach. The average Nusselt number, streamlines, and isotherms were used to assess the thermal and flow properties. The average Nusselt number increases by 16.11 when trapezoidal fins are used in place of traditional straight fins, and by 18.45 when rectangular winglets are included. With a 22.5 increase in heat transfer over the rectangular‐wing shape, the TSW configuration has the best thermal performance at Ra = , followed by CTSW (22.1) and CDW (21.0). Additionally, adjusting the winglet arrangement significantly affects thermal behavior. Because of its favorable alignment with buoyancy‐induced flow, the descending structure improves heat transfer by up to 41.11. The results show that aerodynamic winglet design is crucial for improving natural convection heat transfer, and that combining it with radiative nanofluids offers a practical way to create small, high‐performing heat sinks for cutting‐edge electronic cooling applications.
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Massoudi et al. (2026) studied this question.
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