The current status of, and recent advances in, high electron mobility transistor (HEMT) technology for high-performance submicrometer VLSI are presented with a focus on materials, self-aligned device fabrication, and HEMT LSI implementation. The HEMT is a very promising device for ultrahigh-speed LSI/VLSI applications because of the high-mobility GaAs/AlGaAs heterojunction structure. The authors project an optimized chip delay of 40 ps at 10 K-gate VLSI at room temperature.>
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Abe et al. (1989) studied this question.
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