Answers are grounded in this paper and cite their sources.
Lateral-conduction, substrate-free flip-chip (SFFC) light-emitting diodes (LEDs) with peak emission at 276 nm are demonstrated for the first time. The AlGaN multiple quantum well LED structures were grown by metal–organic chemical vapor deposition (MOCVD) on thick-AlN laterally overgrown on sapphire substrates. To fabricate the SFFC LEDs, a newly-developed laser-assisted ablation process was employed to separate the substrate from the LED chips. The chips had physical dimensions of 1100 × 900 µm 2 , and were comprised of four devices each with a 100 × 100 µm 2 junction area. Electrical and optical characterization of the devices revealed no noticeable degradation to their performance due to the laser-lift-off process.
No takes yet. Share an insight, caveat, or question.
Hwang et al. (2011) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: