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July 1, 1999Journal of The Electrochemical Society

Leveling and Microstructural Effects of Additives for Copper Electrodeposition

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Authors

JKJames J. KellyUniversity of Notre DameCTChunyan TianThe Affiliated Yongchuan Hospital of Chongqing Medical UniversityAWAlan C. WestColumbia University

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Cite This Study

Kelly et al. (1999) studied this question.

synapsesocial.com/papers/6a75f1b074b63c188eb20823https://doi.org/10.1149/1.1391968
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