Recent results have reported a strong implantation-temperature dependence between 125°K and room temperature for lattice disorder produced by 200-keV B implantation into Si. Using our previous annealing model incorporating implant temperature and dose rate, we have calculated a characteristic defect annealing time at the threshold of the crystalline to amorphous transition at 173°K for 1 μA/cm2 and find that it agrees very closely with that for neutral vacancy annealing. In addition, we have made measurements of the 1.8μ infrared absorption band, characteristic of the Si divacancy, following room temperature and 85°K implants of 400-keV B11 or Sb121 ions. Very few divacancies are observed immediately after 85°K implants, but annealing growth of divacancies occurs between 150 and 300°K yielding a density almost equal to that for the same ion Ruence at 300°K. These results strongly suggest that below 300°K neutral vacancy motion and trapping control both the implantation-temperature dependence of lattice damage production for B implantations and the divacancy formation upon annealing for B and Sb implants.
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Vook et al. (1970) studied this question.
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