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A technique is developed to control the chemical reactivity of a silicon single-crystal surface through chemical modification with atomic hydrogen. The reactivity of the reconstructed single-crystal surface prepared by high-temperature treatment in an ultrahigh vacuum is significantly decreased by capping the dangling bonds of top-layer silicon atoms with hydrogen atoms. The Si—H bonds on the hydrogenated surface are found to be much more stable against oxidation than the Si—Si back bonds. The hydrogen-passivated silicon surface is reactivated by electron beam irradiation. An ultrathin oxide layer pattern can be prepared using preferential oxidation of the area reactivated by a focused electron beam.
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Takahagi et al. (1990) studied this question.
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