Copper bottom-up deposition in 200 nm trenches by an acid-copper sulfate with only two additives [poly(ethylene glycol) (PEG) and Cl − ] is achieved. The inhibiting effect of electrodeposition by PEG is strongly related to Cl − concentration. Secondary-ion mass spectroscopy measurements show that Cl − is consumed in the electroplating process. The explanation of bottom-up deposition realized in copper superfilling, in which the decrease of Cl − concentration causes rapid electrodeposition on trench bottoms, is verified experimentally.
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Hayase et al. (2002) studied this question.
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