Study on Thermal Stability of Plasma-PH[sub 3] Passivated HfAlO/In[sub 0.53]Ga[sub 0.47]As Gate Stack for Advanced Metal-Oxide-Semiconductor Field Effect Transistor

In this work, we studied the thermal stability of a plasma- passivated gate stack for high speed metal-oxide-semiconductor field effect transistor (MOSFET) application, and results show excellent thermal stability up to with negligible changes in the equivalent oxide thickness, interface trap densities , and subthreshold slope. An increase in leakage current ( at ) after anneal can be attributed to the localized thinning of the gate dielectric and the rough interface caused by the out-diffusion of Ga/As, as observed by transmission electron microscopy and energy dispersion X-ray analysis. measurement by the charge-trapping method showed suppressed at the upper half of the bandgap for plasma- passivated devices, which is favorable for n-channel MOSFET operation.