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Effects of heat treatment on bonding properties, which include bonding strength, photoluminescence intensity, and electrical conduction through the interface, have been investigated in InP-to-Si direct wafer bonding for the first time. Bonding strength and electrical conduction were found to be improved by heat treatment. On the other hand, a degradation of photoluminescence intensity was observed with high-temperature treatment.
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Wada et al. (1994) studied this question.
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