High-resolution permanent photoresist laminate for microsystem applications

A new permanent dry film photoresist, TMMF S2000, is tested and evaluated for microsystem applications. The resist provides high resolution, high aspect ratios, and homogeneous resist thicknesses. Aspect ratios up to 6:1 (height:width) may be achieved for both structures and channels. Buried structures are created by covering channels with a laminated resist layer. In addition, a very fast direct wafer bonding process is developed. In this process, the resist is patterned on a wafer and directly bonded to a second wafer using pressure and heat. Both techniques enable the fabrication of microfluidic chips with high aspect ratio structures.