Carbon complex formation during annealing in the temperature range from 450 to 1150 °C is studied in a carbon-rich polycrystalline edge-defined film-fed grown (EFG) silicon sheet. The result is compared with that obtained in Czochralski (CZ) single-crystal silicon. Infrared (IR) spectroscopy reveals that carbon removal from substitutional sites above 600 °C is greatly inhibited in EFG silicon with respect to that seen in the CZ material. A broad IR peak attributed to C-O complexes appears only after annealing at highest temperatures, while there is no evidence for appearance of the sharp band at 794 cm−1 usually assigned to SiC precipitation. The suppression of carbon complex formation in EFG material is attributed to decreased availability of silicon self-interstitials necessary to promote removal of carbon from substitutional sites and to enhance its diffusivity.
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Pivac et al. (1992) studied this question.
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