A 16-Mbit DRAM fabricated with a 0.6- mu m triple-well CMOS technology on an n-substrate is described. The fast RAS access time of 45 ns has been achieved by the use of a triple-well structure, an optimized chip architecture, and a decoded word-line bootstrap driver. An advanced trench capacitor cell of area 4.8 mu m/sup 2/ is realized by introducing a quarter-pitched memory array arrangement. A three-way voltage-down conversion system enhances RAM performance as well as reliability. The RAM measures 7.87*17.4 mm/sup 2/.>
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Fujii et al. (1989) studied this question.
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