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June 21, 2002Journal of Micromechanics and MicroengineeringOpen Access

A low-temperature wafer bonding technique using patternable materials

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Authors

CPC-T PanIndustrial Technology Research InstituteHYHsiharng YangNational Chung Hsing UniversityMCM-C ChouIndustrial Technology Research Institute

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Pan et al. (2002) studied this question.

synapsesocial.com/papers/6a942909d5a6dcc35cf646a4https://doi.org/10.1088/0960-1317/12/5/315
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