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Analyze physical bandwidth bottlenecks at the switch I/O and front panel in large data centers and evaluate the viability of on-package optical engine integration.

January 27, 2015Optics ExpressOpen Access

Large data centers interconnect bottlenecks

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Authors

AGAli GhiasiBroadcom (Israel)

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Implication

Technical review evaluates optical integration strategies for high-bandwidth switches, indicating trade-offs in thermal reliability and packaging complexity.

Key Points

Analyze physical bandwidth bottlenecks at the switch I/O and front panel in large data centers and evaluate the viability of on-package optical engine integration.
Assessed optical packaging strategies involving vertical-cavity surface-emitting laser (VCSEL) engines integrated into HPC routers, Ethernet switches, and FPGAs.
Evaluated silicon photonics (SiP) solutions utilizing through-silicon via (TSV) stacked dies against thermal and reliability constraints of high-temperature ASIC packages.
Analyzed front panel density capabilities utilizing 25G NRZ signaling and QSFP28 pluggable optical transceivers.
Front panel bandwidth using 25G NRZ signaling and QSFP28 optical modules achieves capacities up to 3.6 Tbps.
Co-packaging VCSEL or SiP optical engines directly with switch ASICs circumvents traditional front-panel bottlenecks but introduces significant thermal and economic trade-offs.

Cite This Study

Ali Ghiasi (2015) studied this question.

synapsesocial.com/papers/6a951caab041a48fba9e5ff8 https://doi.org/10.1364/oe.23.002085

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Implication

Technical review evaluates optical integration strategies for high-bandwidth switches, indicating trade-offs in thermal reliability and packaging complexity.

Large data centers interconnect bottlenecks

Discussion

Member takes

Implication

Key Points

Cite This Study

Large data centers interconnect bottlenecks

Discussion

Member takes

Implication

Key Points

Cite This Study

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