Answers are grounded in this paper and cite their sources.
This paper presents a low power 60 GHz transceiver that includes RF, LO, PLL and BB signal paths integrated into a single chip. The transceiver has been fabricated in a standard 90 nm CMOS process and includes specially designed ESD protection on all mm-wave pads. With a 1.2 V supply the chip consumes 170 mW while transmitting 10 dBm and 138 mW while receiving. Data transmission up to 5 Gb/s on each of I and Q channels has been measured, as has data reception over a 1 m wireless link at 4 Gb/s QPSK with less than 10-11BER.
No takes yet. Share an insight, caveat, or question.
Marcu et al. (2009) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: