Impact of sidewall etching on the dynamic performance of GaN-on-Si E-mode transistors

The aim of this paper is to investigate the role of the etching of the sidewalls of p-GaN on the dynamic performance of normally-off GaN HEMTs with p-type gate. We analyze two wafers having identical epitaxy but with different recipes for the sidewall etching, referred to as “Etch A” (non-optimized) and “Etch B” (optimized). We demonstrate the following relevant results: (i) the devices with non-optimized etching (Etch A), when submitted to positive gate bias, show a negative threshold voltage shift and a decrease in Ron, which are ascribed to hole injection under the gate and/or in the access regions; (ii) transient characterization indicates the existence of two trap states, with activation energies of 0.84 eV (C N defects) and 0.30 eV. The latter (with time-constants in the ms range) is indicative of the hole de-trapping process, possibly related to trap states in the AlGaN barrier or at the passivation/AlGaN interface; (iii) by optimizing the p-GaN sidewall etching (for the same epitaxy) it is possible to completely eliminate the threshold voltage shift. This indicates that hole injection mostly takes place along the sidewalls.