A microspherical Cu–Sn alloy was electrodeposited on porous Cu substrate that was fabricated by electrodeposition with hydrogen bubbles as dynamic template and served ultimately as a current collector. The Cu–Sn alloy was determined by X-ray diffraction as an intermetallic composite of Cu 6 Sn 5 . Scanning electron microscope images illustrated that the Cu 6 Sn 5 alloy consists in sphere-shaped particles growing on toothed branches of the porous Cu substrate. A galvanostatic charging/discharging test indicated that the microspherical Cu 6 Sn 5 alloy on porous Cu substrate exhibited high first-discharge and -charge capacity, which were determined to be 563 and 493 mAh g − 1 , respectively. It has also revealed that the as-prepared electrode displayed a good retention of capacity, and the discharge and charge capacities at the 20th cycle were measured as high as 445 and 407 mAh g − 1 .
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Fan et al. (2008) studied this question.
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