Fracture dynamics in Smart Cut™ technology: Wafer deformation measurement

High-Speed Cameras help in characterizing the splitting step in the Smart Cut™ technology. Full wafer-scale deformation monitoring upon annealing is then possible. This paper describes the setup, equipment and methodology used to estimate the backside wafer deformation and curvature upon fracture propagation in situ during the fracture step. Finally, with such a setup, the fracture process of a SOI-ready structure is studied dynamically over the whole propagation time scale. These results are consistent with literature work performed using punctual measurements methods and will allow in the future to emphasize the effect of process’ and structure’s geometry.