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May 9, 2005Applied Physics Letters

Thermal analysis of flip-chip packaged 280 nm nitride-based deep ultraviolet light-emitting diodes

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Authors

MSM. ShatalovMinsk Regional Institute of Education DevelopmentACA. ChitnisUniversity of South CarolinaPYPooja YadavUniversity of Allahabad

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Shatalov et al. (2005) studied this question.

synapsesocial.com/papers/6a9c686e34218c16f202cff1https://doi.org/10.1063/1.1927695
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