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January 1, 1988Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena

Plasma etching of organic materials. II. Polyimide etching and passivation downstream of an O2–CF4–Ar microwave plasma

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Authors

VVV. VukanovićRochester Institute of Technology GTG. A. TakacsRochester Institute of Technology EMEdward Matuszak

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Vukanović et al. (1988) studied this question.

synapsesocial.com/papers/6aa03e8b9303650de3c7296f https://doi.org/10.1116/1.584054

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