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November 29, 2007IEEE Photonics Technology Letters

Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films

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EHEiji HigurashiTohoku UniversityTITeppei ImamuraTSTadatomo SugaCollaborative Research Group

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Higurashi et al. (2007) studied this question.

synapsesocial.com/papers/6aa9218ddf41e3f51602c093https://doi.org/10.1109/lpt.2007.908642
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