Answers are grounded in this paper and cite their sources.
Al-alloys and their anodic oxides were used as the gate and the gate dielectric, respectively, for the indium-zinc-oxide (IZO) thin-film transistors (TFTs). The influence of the Al-alloys on the performances of the IZO-TFTs was investigated. It was found that the hillock formation could be completely suppressed by doping neodymium (Nd) or cerium (Ce) into Al. However, the mobility of the IZO-TFT with Al-Ce gate was only 2 × 10 −4 cm 2 V −1 s −1 , about five orders lower than that of the IZO-TFT with Al-Nd gate (11.6 cm 2 V −1 s −1 ). Further analysis showed that Ce 3+ and Ce 4+ ions were existence in the oxide film obtained by anodizing Al-Ce alloy, and they would diffuse into IZO film. The Ce 4+ ion could act as an electron trap due to its strong oxidizability, so the IZO-TFTs with Al-Ce gate would experience seriously degradation. In the case of the oxide film obtain by anodizing Al-Nd alloy, only Nd 3+ were found, which was stable and would not produce electron traps. Moreover, the existence of Nd would suppress undesirable free electron formation in the channel, resulting in low off-current, low subthreshold swing, little hysteresis, and high electrical stability under gate bias stress.
No takes yet. Share an insight, caveat, or question.
Luo et al. (2012) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: