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The curing and adhesive properties of one‐component epoxy resins containing Epikote 828 and diimines, derived from N,N′‐di(1‐ethylpropylidene)‐m‐xylylenediamine, N,N′‐di(1‐ethylpropylidene)‐1,3‐diaminomethylcyclohexane (2), and N,N′‐di(1,3‐dimethylbutylidene)‐m‐xylylenediamine, which were used as water‐initiated hardeners, were examined. Diethyl ketone‐based imines with a lower electron density on the CN carbon were efficiently hydrolyzed and showed curing activity. 2, a novel diethyl ketone‐based diimine, served as an efficient latent hardener of the epoxy resin. A paste of the epoxy resin with 2 showed good storage stability at room temperature and good adhesive properties.
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Suzuki et al. (2003) studied this question.
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